Ichor has a solution for customers that need to clamp wafers as thin as 150µ. Thin wafer clamping is used in manufacturing steps to develop semiconductors including single chamber etch processes.
Our newly developed clamp will accomodate such thin wafers as 150µ. For a brief overview of the main features, continue reading.
To receive more detailed information, please reach out to us.
Features:
- Thin wafer clamping down to 150µ
- Wafer cooling with traditional Helium cooling systems
Benefits:
- Allows for clamping of thin wafers alongside normal thickness wafers
- No change of additional hardware required only clamp
Clamps are available for all single chamber etch modules. If you are interested in more info regarding our thin wafer clamping solutions, please contact us.
For more information on our full range of semiconductor equipment solutions, view our refurbished semiconductor equipment page or download our refurbished tools buyers guide:
