Modeling and Characterizing the Performance of Fluid Mixing Components in Single-Wafer Wet Processing Equipment for Nanoscale Semiconductor Device Fabrication
Ichor Systems focused on reviewing the reactive to proactive approach for Wafer Yield Management, specifically to address challenges faced in nanoscale wet cleaning process development. Proactive approaches to characterize process performance, predict wafer spatial pattern, and select equipment design tailored for specific applications are key. Typical semiconductor wet etching processes require accurate and precise acid concentration to produce desired and consistent etch length. Optimizing mixing uniformity reduces the variations in etch length across multiple channels on a 2-dimensional wafer surface.
Download the presentation to read more about the design of the experiment, modeling, key assumptions, and conclusions.
- World’s Leading Provider of Critical Fluid Delivery Subsystems and Components for Semiconductor Capital Equipment
- Gas and chemical delivery subsystems are key elements of process tools used in the manufacturing of semiconductor devices
- Over 20 years of operational history providing design, qualification, manufacturing and testing expertise to key OEMs throughout the product development cycle
- Global manufacturing footprint in the US, Malaysia, Singapore, Korea, Mexico and Scotland, with facilities strategically located in close proximity to key customers
Gary Xing, Michael Vogtmann, Randy Treur, Phil Barros, Paul Werbaneth
Ichor Systems
Fremont, California